Some Galaxy S27 models might run hotter thanks to this chip choice

• Samsung is reportedly thinking about ditching an advanced packaging process for the Exynos 2700 chipset.
• This could potentially result in the processor running hotter, although Samsung is introducing other cooling measures.
• The Exynos 2700 is expected to power some Galaxy S27 and S27 Plus models next year.

Some Galaxy S27 and S27 Plus models are expected to be powered by Samsung’s own Exynos 2700 processor. We’ve already heard the first rumors about this chipset, but a new story suggests that the chip could undergo a somewhat concerning change.

Sisa-Journal reports that the Exynos 2700 chip could ditch Fan-Out Wafer-Level Packaging (FOWLP). Samsung is apparently thinking about abandoning this advanced manufacturing process because it’s a costly process and could also affect yield rates.