Monolithic three-dimensional integration of silicon transistors

Nature, Published online: 27 May 2026; doi:10.1038/s41586-026-10496-6

Uniformly doped, ultrathin single-crystalline silicon nanomembranes can be vertically stacked at low temperature using a roll-transfer-printing process that is scalable to wafer scale and tolerant to substrate topology and surface roughness for constructing high-performance monolithic three-dimensional integrated circuits.